• 凯发k8国际

    (Module)OLED Film Laser Drilling Equipment
    The equipment utilizes laser energy to remove parts of the product by a specific shape to form the hole-shaped of the product. The equipment comprises a feeding unit, a laser cutting unit, and an unloading unit.
    Equipment Advantages
    • 01
      Synchronous cutting with multiple laser heads to improve cutting efficiency.
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      High-precision visual positioning and inspection system.
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      High efficiency cutting dust removal and platform cleaning function.
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    Equipment Picture
    Basic Parameters
    • 1. Applicable products: flexible OLED
    • 2. Product thickness:0.1mm~0.8mm
    • 3. Applicable product size: 1~8 inches(6mmx10mm~140mmx200mm)
    • 4. Tack Time: 4.5s/cell(8 inches)
    • 5. Heat influence range :≤45µm(Laser cutting surface)
    • 6. Cutting accuracy: ≤±20µm(CPK≥1.33)
    • 7. Jig replacement position: cutting platform
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